NSC’s TGV fabrication process is capable of fabricating high aspect ratio via on large-sized substrates.

Features

Vias with high aperture ratio and high aspect ratio

For LCD displays, semiconductor devices, 2.5D interposers, and 3D semiconductor packages, NSC provides process for fabricating applicable glass vias with high aperture ratio and high aspect ratio.

開口率の高い、高アスペクト比の貫通孔

TGV substrate surface/cross section

開口率の高い、高アスペクト比の貫通孔

Cross section of the TGV

Glass type Non-alkali glass, Alkali glass, Quartz, heat-resisting glass
Size Min 120 mm x 120 mm, Max 730 mm x 920 mm
Glass thickness 0.05mmt〜1.65mmt
Via type Through Via (True circle or Ellipse)
Blind Via (True circle or Ellipse)
Via shape Vertical shape, Hourglass shape, Inverted cone shape
Via diameter

 

ertical via diameter ≧ Φ 1000μm
Hourglass shape Φ 20μm 〜 200μm
Inverted cone shape ≧ Φ 20μm
*There is a thickness limitation.

Via pitch Surface diameter × 10 % + 15μm
Via position accuracy within ±15μm
Aspect ratio Maximum 10 : 1 (Glass thickness/ via diameter)
*Processable glass type is limited.
TGVアスペクト比(ピンクグラフ)英文verのサムネイル

Available aspect ratios of hourglass shape TGV in each specified glass thickness are shown in the graph above.

 

 

TGV アスペクト比図のサムネイル

Uses and Applications

Specific Examples
  • 2.5D interposers, 3D semiconductor packages
  • LCD displays
  • Semiconductor power devices etc.

Copper plating onto glass workpieces

Copper plating onto glass workpieces with TGV

The method for copper plating, which has been developed along with NSC’s TGV fabrication technology, is available now. NSC provides process services for the following types of plating: Process of “Conformal plating,” in which the copper is coated onto the via surface. Process of “Via fill plating,” in which the copper is filled into the vias.

Conformal plating
コンフォーマルメッキ
Via fill plating
フィリングメッキ

High adhesiveness and High reliability

Cross-cut test was conducted on the plated substrates. The result shows that the plated copper strongly adhered to the glass and did not separate from the substrates.

Copper plating Specification

Type of plating

Conformal plating

Via fill plating

Glass type

Non-alkali glass, Alkali glass, Quartz, heat-resistant glass

Glass size

Min 50mmx50mm, Max 400mmx500mm or

Min 50mmx50mm, Max 150mmx150mm

Via type

Through Via (True circle or Ellipse)

Through Via (True circle or Ellipse)

Via shape

Vertical shape, Hourglass shape, Inverted cone shape

Vertical shape, Hourglass shape, Inverted cone shape

Via depth

Through Via

100μm ~ 800μm

100μm ~ 600μm

Blind Via

10um ~ 100μm

50μm ~ 100μm

Via diameter

Through Via

50μm ~

50μm ~ 100μm

Blind Via

10μm ~

50μm ~ 100μm

Adhesive strength

8 N/cm

Cross-cut test

JIS5600K No separation

TGV+Cuめっきガラス断面図

Cross section of glass substrate with TGV + Cu plating
Through combination with TGV glass substrates the workpiece can be of wide application.

Specific Examples
  • Glass Interposer
  • MEMS
  • Next-generation displays etc.