NSC’s TGV fabrication process is capable of fabricating high aspect ratio via on large-sized substrates.
Features
Vias with high aperture ratio and high aspect ratio
For LCD displays, semiconductor devices, 2.5D interposers, and 3D semiconductor packages, NSC provides process for fabricating applicable glass vias with high aperture ratio and high aspect ratio.
TGV substrate surface/cross section
Cross section of the TGV
| Glass type | Non-alkali glass, Alkali glass, Quartz, heat-resisting glass |
|---|---|
| Size | Min 120 mm x 120 mm, Max 730 mm x 920 mm |
| Glass thickness | 0.05mmt〜1.65mmt |
| Via type | Through Via (True circle or Ellipse) |
| Blind Via (True circle or Ellipse) | |
| Via shape | Vertical shape, Hourglass shape, Inverted cone shape |
| Via diameter |
ertical via diameter ≧ Φ 1000μm |
| Via pitch | Surface diameter × 10 % + 15μm |
| Via position accuracy | within ±15μm |
| Aspect ratio | Maximum 10 : 1 (Glass thickness/ via diameter) *Processable glass type is limited. |
Available aspect ratios of hourglass shape TGV in each specified glass thickness are shown in the graph above.
Uses and Applications
Specific Examples
- 2.5D interposers, 3D semiconductor packages
- LCD displays
- Semiconductor power devices etc.
Copper plating onto glass workpieces
Copper plating onto glass workpieces with TGV
The method for copper plating, which has been developed along with NSC’s TGV fabrication technology, is available now. NSC provides process services for the following types of plating: Process of “Conformal plating,” in which the copper is coated onto the via surface. Process of “Via fill plating,” in which the copper is filled into the vias.
Conformal plating
Via fill plating
High adhesiveness and High reliability
Cross-cut test was conducted on the plated substrates. The result shows that the plated copper strongly adhered to the glass and did not separate from the substrates.
Copper plating Specification
|
Type of plating |
Conformal plating |
Via fill plating |
|
|---|---|---|---|
|
Glass type |
Non-alkali glass, Alkali glass, Quartz, heat-resistant glass |
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|
Glass size |
Min 50mmｘ50mm, Max 400mmｘ500mm |
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Via type |
Through Via (True circle or Ellipse) |
Through Via (True circle or Ellipse) |
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|
Via shape |
Vertical shape, Hourglass shape, Inverted cone shape |
Vertical shape, Hourglass shape, Inverted cone shape |
|
|
Via depth |
Through Via |
100μm ～ 800μm |
100μm ～ 600μm |
|
Blind Via |
10um ～ 100μm |
50μm ～ 100μm |
|
|
Via diameter |
Through Via |
50μm ～ |
50μm ～ 100μm |
|
Blind Via |
10μm ～ |
50μm ～ 100μm |
|
|
Adhesive strength |
8 N/cm |
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Cross-cut test |
JIS5600K No separation |
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Cross section of glass substrate with TGV + Cu plating
Through combination with TGV glass substrates the workpiece can be of wide application.
Specific Examples
- Glass Interposer
- MEMS
- Next-generation displays etc.